In Brief

Buetow, Mike
December 2004
Circuits Assembly;Dec2004, Vol. 15 Issue 12, p8
Trade Publication
The article presents information on various developments in electronics industry. Building on its ODM capabilities, Flextronics Inc. will buy Agilent Technologies' camera module business. Celeritek shareholders approved the sale of the company's defense electronics business to a subsidiary of Teledyne Technologies for $33 million in cash. Teledyne intends to relocate the business from Santa Clara, California, and consolidate it with Teledyne Microwave in Mountain View, California. EV Group , a wafer-bonding and lithography equipment suppler, and Datacon Technology AG , a flip-chip and die bonding equipment supplier, will develop and market advanced-chip-to-wafer (AC2W) technology. AC2W technology offers high device density through stacked devices, short interconnects and higher functional density, enabling the integration of various device technologies. Nu Visions Manufacturing has opened a CEM plant for PCB and electromechanical assembly in Tijuana, Mexico. The facility, located on a 670-acre site in Tijuana Industrial Park, is equipped with SMT and through-hole manufacturing equipment, strict ESD controls and information technology infrastructure identical to its Springfield, Massachusetts, facility.


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