TITLE

Sen Lee, Ph.D., Joins Advisory Board

PUB. DATE
March 2008
SOURCE
Advanced Packaging;Mar2008, Vol. 17 Issue 2, p19
SOURCE TYPE
Trade Publication
DOC. TYPE
Article
ABSTRACT
The article announces that Nextreme Thermal Solutions' chief technical officer, Seri Lee, joined the editorials advisory board of "Advanced Packaging."
ACCESSION #
31203466

 

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